| 摘要 |
PURPOSE:To improve moisture-resistant property by covering one part of at least one side of an opening section in a metallic pad with a ball formed by compression-bonding a bonding wire with the metallic pad. CONSTITUTION:One part of at least one side of an opening section 2 in a metallic pad 1 is covered with a ball 4 formed by compression-bonding a bonding wire 3 with the metallic pad 1. An opening section such as one 2 in a protective film on the metallic pad 1 is sufficiently smaller than a ball such as one 4 as the compression-bonding section of the bonding wire 3, and the greater part of the opening section 2 is covered with the lower section of the ball 4. Accordingly, even when the opening section 2 in the aluminum pad 1 except the lower section of the ball 4 is corroded by moisture, which is transmitted on the bonding wire 3 and permeates, aluminum under the ball 4 is difficult to be corroded because the aluminum is sufficiently thick and is connected directly to aluminum under the protective film, and a conductive state between the bonding wire and an internal circuit can be ensured in the aluminum section. |
