摘要 |
A die package for forging a central disc structure having a plurality of integrally formed appendages extending radially outwardly therefrom includes a circumferential array of abutting die segments defining a central cavity within the array and appendage forming cavities between the segments. Each die segment has a locating hole in its upper surface, and an annular support member overlies the holes and has a plurality of locating holes therein, one hole corresponding to each hole in said die segments. A non-metallic rod, such as a glass rod, is disposed tightly within and extends between each pair of aligned holes, thereby locating the die segments accurately relative to each other and to a central axis of the die package. The rods are shearable at elevated temperatures to enable radial movement of the die segments after forging for releasing the forged component from the die package.
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