发明名称 |
Method of producing a contact device for a switch |
摘要 |
A novel method of producing a contact device for a switch is disclosed. According to the present invention, a powdered contact alloy material is pressed with a substrate on which is placed the contact material. The resulting molded article is sintered for bonding said contact alloy material to said substrate. The resulting sintered product is machined to have the shape of a contact and ultimately an electrode bar is attached by brazing to said substrate.
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申请公布号 |
US4530815(A) |
申请公布日期 |
1985.07.23 |
申请号 |
US19830508160 |
申请日期 |
1983.06.27 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
INAGAKI, KOUICHI |
分类号 |
H01H1/023;H01H11/04;(IPC1-7):B22F7/04;B22F3/16 |
主分类号 |
H01H1/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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