发明名称 Method of producing a contact device for a switch
摘要 A novel method of producing a contact device for a switch is disclosed. According to the present invention, a powdered contact alloy material is pressed with a substrate on which is placed the contact material. The resulting molded article is sintered for bonding said contact alloy material to said substrate. The resulting sintered product is machined to have the shape of a contact and ultimately an electrode bar is attached by brazing to said substrate.
申请公布号 US4530815(A) 申请公布日期 1985.07.23
申请号 US19830508160 申请日期 1983.06.27
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 INAGAKI, KOUICHI
分类号 H01H1/023;H01H11/04;(IPC1-7):B22F7/04;B22F3/16 主分类号 H01H1/023
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