发明名称 Method for making a solder joint and the solder joint made thereby
摘要 The method is utilized for forming a solder joint (51-53) between a wire end portion (21-30) of a coil mounted on a hub (16) and an end tab (73) of a male or female connector (31-36) that can be mounted on a support (41-46) fixed to the hub (16). The method includes the steps of: placing at least one wire end portion (24) adjacent an end tab (73); placing an encircling ring (80; 180) of material about the end tab (73) and the at least one wire end portion (24), said ring of encircling material being sized to fit snugly about the end tab (73) and the at least one wire end portion (24) so that they are juxtaposed to each other and so that the resiliency of the at least one wire end portion (24) urging it away from the end tab (73) is sufficient to frictionally hold the ring (80; 180) of encircling material around the end tab ( 73) and the at least one wire end portion (24); inverting and dipping the assembly (78) of the end tab (73), the at least one wire end portion (24) and the ring (80; 180) of encircling material into a solder bath; and removing the assembly (53) from the solder bath and allowing it to cool and harden. The solder joint (53) includes at least one wire end portion (24) juxtaposed to a connector end tab (73) and having a ring (80; 180) of encircling material holding them together and adhered solder (86) in and around the at least one wire end portion (24), the end tab (73) and the ring (80; 180) of encircling material.
申请公布号 US4530563(A) 申请公布日期 1985.07.23
申请号 US19820431850 申请日期 1982.09.30
申请人 COILCRAFT, INC. 发明人 BRZEZINSKI, DOROTHY S.
分类号 H01F5/04;H01F41/10;H01R4/02;H01R43/02 主分类号 H01F5/04
代理机构 代理人
主权项
地址