| 摘要 |
PURPOSE:To measure easily a film thickness of a protection film after flat polishing with high accuracy by forming a monitor pattern for measuring a protection film to a required part on a base at the same time when a connecting terminal pattern is formed. CONSTITUTION:In forming a pattern 3 connecting an element 2 to a recording/ reproduction circuit on a base 1, a film thickness measuring monitor pattern 4 of the same thickness is formed to a required part on the base 1 through coating at the same time. A protection film 5 is coated thicker than the pattern 3 on the entire surface of it. Then the protection film 5 is polished and finished so as to expose the pattern 3. The pattern 4 is exposed at the same time. A resist is applied to it on the entire face, the resist film 6 is applied with pattern while it is left only on the base 1 except the pattern 4, the pattern 4 is removed selectively through etching by using the resist film 6 as a mask so as to form a recess 7. The film thickness measuring monitor pattern 7a is obtained by removing the film 6 with dissolving. The film thickness of the film 5a is measured easily from a step difference (d) between the bottom of the recess and the surface of the protection film 5a. |
