| 摘要 |
PURPOSE:To enable to scarcely generate a gate remainder by a method wherein a notch is provided at a position corresponding to a gate for resin sealing located at the side end of one way on the inner side of one of two lead frames. CONSTITUTION:This semiconductor device has a bed part 3, whereon a semiconductor element pellet (has not been shown in the diagram) is to be mounted in the central part between mutually parallel two lead frames 2', and plural lead parts, which have been provided in the peripheral parts of the bed part 3 and have been formed in a form spreading radially from the vicinity of the bed part 3, in the same manner as the conventional one, but a rectangular notch 12 is provided at a position corresponding to a gate for resin sealing located at the side end of one way on the inner side of one way of the lead frames 2' in this semiconductor device. The size of the notch 12 is the bigger the better from an aim of enabling the adhesion of a gate part resin 6' to lower, but the size is formed in such a way to have a width and a depth of one-second or thereabouts of the width of the frame 2' in order to maintain the strength of the frame 2'. In case a resin sealing was performed, the gate part resin 6' can be easily removed by applying a mechanical external force without generating a gate remainder, because there exists no lead frame 2' to cause an adhesion on the upper face of the point 6'a of the gate part resin 6'. |
