| 摘要 |
PURPOSE:To enable to cut down the manufacturing cost of the titled device in an automation of the mounting process of the device and to realize a plane mounting by a method wherein a radiating fin in a bending structure corresponding to those of lead pins 12, 12... is proviced, and this radiating fin is soldered to a wiring substrate having a radiator structure and are installed thereon. CONSTITUTION:This sealed semiconductor device is a device in a structure wherein a radiating fin 13 has been bend-formed in a structure corresponding to those of lead pins 12, 12... are placed on the bonding region of the printed substrate (wiring substrate) and are soldered, and at the same time, the radiating fin 13 is soldered to the printed substrate formed in a radiator structure. As material for the radiating fin 3 are selected Cu, 194 alloy, 42 alloy, etc., according to characteristics which will be required. According to such a constitution, the mounting of the radiator to the radiating fin 13 can be performed at the same time as the soldering time of lead pins 12, 12.... |
