发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE:To provide titled composition composed of a polyamide resin, an acid- modified olefin copolymer, a polyolefin resin and a compound containing epoxy group, having excellent toughness, abrasion resistance, chemical resistance, etc. and high rigidity, and useful for electrical parts, automobile parts, film, etc. CONSTITUTION:The objective composition can be produced by compounding (A) 100pts.(wt.) of a resin composition obtained by compounding (i) 35-85(wt)% polyamide resin with (ii) 10-60% acid-modified olefin copolymer obtained by the graft copolymerization of (a) 100pts. of an olefin copolymer with (b) 0.1- 2.0pts. of one or more monomers containing acid anhydride group and selected from citraconic anhydride, 3-methyl-4-cyclohexene-1,2-dicarboxylic acid anhydride, maleic anhydride, (methyl)nadic anhydride and itaconic anhydride and (iii) 5- 35% polyolefin resin [sum of the components (i)-(iii) is 100%] with (B) 0.1- 20pts. of a compound containing two or more epoxy groups.
申请公布号 JPS60137921(A) 申请公布日期 1985.07.22
申请号 JP19830244632 申请日期 1983.12.27
申请人 DAINIPPON INK KAGAKU KOGYO KK 发明人 TAGUCHI HIROSHI;MORI KAORU
分类号 C08K5/04;C08G59/00;C08G59/40;C08L7/00;C08L21/00;C08L23/00;C08L51/00;C08L51/02;C08L51/06;C08L63/00;C08L77/00;C08L101/00 主分类号 C08K5/04
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