| 摘要 |
PURPOSE:To prevent a creeping to the peripheral region of the back of a sheet body of an organic agent for forming a film by injecting a gas to the whole peripheral region of the back of the sheet body from the side surface of a tabular body when the organic film is formed on the main surface of the sheet body. CONSTITUTION:A wafer 50 is placed on the upper surface of a tabular body 1a so that the central section of the main surface of the wafer is placed on a vacuum hole 1c. A high-pressure gas is injected to the whole peripheral region of the back of the wafer 50 from gas injection holes 4a, 4b. A resist agent 51 for forming a film is dropped onto the central section of the main surface of the wafer 50, and the wafer 50 is turned. Accordingly, a creeping of the resit to the back side as an unnecessary section scattering to the outside from the periphery of the wafer of the resist agent 51 can be prevented because the high-pressure gas is injected to the whole peripheral region of the back of the wafer from the injection holes. |
