| 摘要 |
PURPOSE:To eliminate the silver-plating of a lead frame by forming a conductive reflecting layer of silver only on the mounting portion and the reflecting surface of the frame, and securing a semiconductor light emitting pellet on the mounting portion of the layer. CONSTITUTION:Silver paste 14 is coated on the mounting portion 12 and a reflecting surface 13 for surrounding the periphery of the portion at the cathode side 11a of a lead frame 11. Then, after a pellet 15 is placed on the portion 12, a heat treatment is performed to cure the paste 14. Then, the electrodes 15 of the pellet 15 and the anode side 11b of the frame 11 are bonding-connected with gold wirings 17, and silver paste 18 is further coated on the connecting portion of the wirings 17 and the anode side 11b. Then, a heat treatment is performed, the paste 18 is cured, and the pellet 15 and the ends of the leads are sealed with epoxy resin. |
