发明名称 |
PLANAR MAGNETRON SPUTTERING METHOD |
摘要 |
PURPOSE:To reduce the number of foreign matter sticking on a substrate by making the direction of an electric field and that of a magnetic field parallel to each other on the boundary between plural target members to inhibit abnormal electric discharge on the boundary. CONSTITUTION:Plural target members 801-803 are arranged on an electrode 102. At least one of the members is made of a material different from the material of other members. The direction of an electric field and that of a magnetic field are made almost parallel to each other on each boundary between the members, and the principal faces of the members 801-803 are sputtered. By this method the number of foreign matter sticking on a substrate 110 is reduced. |
申请公布号 |
JPS60135574(A) |
申请公布日期 |
1985.07.18 |
申请号 |
JP19830243844 |
申请日期 |
1983.12.26 |
申请人 |
HITACHI SEISAKUSHO KK |
发明人 |
SAKATA MASAO;KOBAYASHI HIDE;KASAHARA OSAMU;OOGISHI HIDEJI;ABE KATSUO |
分类号 |
C23C14/36;C23C14/35;H01J37/34 |
主分类号 |
C23C14/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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