METHOD FOR MANUFACTURING A FINE-PATTERNED THICK FILM CONDUCTOR STRUCTURE

摘要

The manufacture of a fine-patterned thick-film conductor structure, e.g. a printed-circuit board, comprising the steps of forming a plating resist (2) on a thin metal plate (1) at areas other than land areas, electroplating the thin metal plate using the thin metal plate as a cathode electrode to a thickness of 0.3-10 mu m at a current density of 0.05-2A/dm<2> and to the desired thickness at 3-50 A/dm<2> to form conductors (3) having a circuit density of no less than three lines/mm and a thickness of 15-200 mu m, bonding the electroplated thin metal plate to an insulative substrate (5) with the thin metal plate side facing up using a bonding agent (4) and etching the thin metal plate, or removing all or the areas other than the land areas of the thin metal plate.