Apparatus for solder removal.

摘要

A solder levelling system for use in vapor phase soldering systems for solder coating and levelling of printed wiring boards includes a board transport system (24) which operates in a near-horizontal mode for moving the board to be solder coated into and out of a vapor zone in a chamber (36) having a solder pot (30) which has a throat (32) in line with the plane of the transport system. The near-horizontal product movement through the vapor and into and out of the solder pot prevents solder sag associated with vertically loaded systems and permits variations in coating thickness through control of solder deposited on the opposing board surfaces. Levelling is accomplished with nozzles (64-66) positioned in a vapor-filled chamber to either side of the board transport system between the solder pot (30) and the throat (34) of the chamber, in which perpendicular nozzle offset distance from the borad as well as nozzle angle are adjustable by rotation and translation of a sector to which each nozzle is secured.