| 摘要 |
PURPOSE:To enable to avoid a semiconductor device from being broken by enabling to disperse a gas pressure even though gas generates in a cavity by a method wherein, when a semiconductor pellet is fixed on a package base, the pellet is surrounded with dams, a gelatinous silicone resin is filled in a part surrounded with the dams, a sealing part is provided on the outside of the dams surrounding and the whole surface is covered with a cap having the cavity formed in the lower surface of the cap, the sealing part is constituted of plural frame bodies, each consisting of walls which have respectively numerous holes. CONSTITUTION:A semiconductor element 1 is fixed on the central part of the surface of a package base 2 having plural connecting pins 8 protruding downwards from the lower surface of the base 2 and the element 1 is performed a prescribed connection using wires 7. These are surrounded with dams 5, a gelatinous silicone resin 6 is filled in a part surrounded with the dams 5, a sealing part 4 consisting of a glass or resin material, etc., is provided on the outside of the dams 5 surrounding and the whole surface is covered with a cap 3 having a cavity 9 formed in the lower surface of the cap 3. In this constitution, the sealing part 4 is constituted of plural encircling walls 13, each having numerous cavities 12, and also, the wall thickness of the frame bodies are respectively formed thick from the inside through the outside. |
