发明名称 |
CARRIER ELEMENT FOR AN IC MODULE |
摘要 |
A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses. |
申请公布号 |
GB2081974(B) |
申请公布日期 |
1985.07.17 |
申请号 |
GB19810023900 |
申请日期 |
1981.08.05 |
申请人 |
GAO GES FUER AUTOMATION & ORGANISATION MBH |
发明人 |
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分类号 |
H01L21/56;B42D15/02;B42D15/10;B44F1/12;G06K19/077;H01L21/60;H01L23/28;H01L23/31;H01L23/48;H01L23/498;H01L23/538 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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