发明名称 POLISHING METHOD OF INTERNAL WALL OF HOLE IN HARD AND FRAGILE CONDUCTIVE MATERIAL WORK
摘要 PURPOSE:To obtain a polished surface with no chipping and crack and almost no machining quality changed layer, by fixing a work in an electrolyte uniformly dispersing fine abrasive grains and performing compound machining by a tool of elastic conductive material. CONSTITUTION:A work 1 is fixed in an electrolyte 3 uniformly dispersing a separating fine afrasive grain 2 of alumina or the like. An objective hole 1a to be polished inserts inside a cylindrical tool 4 by an elastic conductive material of conductive rubber or the like with a diameter smaller than that of said hole 1a further with the axial line being parallel. A DC power supply 6 is connected between the work 1 and a shaft 5 with the work 1 being a plus side and the shaft 5 being a minus side. While a driving gear, connected with the shaft 5, both presses the tool 4 by polishing pressure, forming a suitable film thickness in a fluid bearing condition for an internal wall of the objective hole 1a, and rotates the tool 4 on its own axis, further rotates the tool 4 along the internal wall or the objective hole 1a to be polished.
申请公布号 JPS61188024(A) 申请公布日期 1986.08.21
申请号 JP19850027772 申请日期 1985.02.15
申请人 FUJI ELECTRIC CO LTD 发明人 NAKAMURA KOJI
分类号 B23H5/00;B23H5/06;(IPC1-7):B23H5/06 主分类号 B23H5/00
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