发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To enhance the sealing reliability by eliminating the warps after press processing by a method wherein a rectangular recess is formed at the bottom of the recessform section of a cap. CONSTITUTION:A punch 30, a pressing device, makes a columnar form having a cross-section of the same form as that of the recessform section of the cap 18, and its bottom projects out in a polygonal form: a form of projection toward the center whose cross-section is polygonal. The punch 30 of such a form is pressed on a flat plate of a hoop material fixed on a die 22 having a recess, and thus the cap 18 is provided with a recess of the same form as the projection 31 of the punch 30. As a result, stress disperses to the corners of the bottom, resulting in the elimination of the warp of the whole body.
申请公布号 JPS60133741(A) 申请公布日期 1985.07.16
申请号 JP19830241307 申请日期 1983.12.21
申请人 FUJITSU KK 发明人 WATANABE HISASHI
分类号 H01L21/48;H01L21/50;H01L23/02;H01L23/04 主分类号 H01L21/48
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