| 摘要 |
PURPOSE:To hold high reliability of connecting a semiconductor chip with a printed circuit board even if a heat is applied by forming three plates to be sealed with the chip of base materials having similar thermal expansion coefficient, and forming a conductor film as leads on the peripheral wall of a through hole. CONSTITUTION:After the second layer plate 10 is bonded to dispose a through hole 13 above a conductor 6, copper is placed on the hole 13 or silver-resin conductive paint printed on the hole 13 is heated to be thermoset to form a conductive film 16 on the peripheral wall of the hole 13, and the conductor 6 is connected with a conductor 12. Then, a semiconductor chip 17 and a conductor 17 of the first layer plate 4 are connected. Eventually, when a prepreg 14 is interposed between the second layer plate 10 and the third layer plate 15, heated and pressed, it is bonded so that the chip 17 is sealed in the first plate, 4, the second plate 10 and the third plate 15. Since the thermal expansion coefficients of the plates 4, 10, 15 and the printed circuit board 1 are equal, elongating/shrinking stress due to the environmental temperature change is not applied to the soldered portion. |
