发明名称 |
Stress absorption matrix |
摘要 |
An apparatus for interfacing materials and absorbing disparate thermal expansions thereof utilizes a woven wire mesh to support a predetermined thickness of a first soft solder which absorbs expansions, and utilizes a second soft solder having a lower melting point than the first to coat the surfaces of the wire mesh/first soft solder combination so that the materials can be bonded thereto. |
申请公布号 |
US4529836(A) |
申请公布日期 |
1985.07.16 |
申请号 |
US19830514069 |
申请日期 |
1983.07.15 |
申请人 |
SPERRY CORPORATION |
发明人 |
POWERS, V. B.;ROBERTS, J. W.;DHALIWALL, J. S. |
分类号 |
H01L23/373;H05K1/02;H05K1/05;H05K3/00;(IPC1-7):H01R4/02 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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