CURE INDICATOR FOR DRY FILM SOLDER MASK

摘要

TITLE CURE INDICATOR FOR DRY FILM SOLDER MASK Of THE DISCLOSURE A method for placing a marker on a dry film solder mask of a printed circuit card such that the cured state of the mask may be verified prior to utilization of the card in subsequent manufacturing operations. The key step of the method is the placement of a small area of a wet solder mask compound on the card prior to the curing of the mask, whereby the cured condition of the wet solder mask compound indicates that the board has been cured.