| 摘要 |
PURPOSE:To provide a plated stainless steel suitable particularly for an application as an electronic part material or the like for which high performance and high reliability are required by providing an extremely thin intermediate Ni layer between an electroplating layer and a base stainless steel layer. CONSTITUTION:A clean base stainless steel subjected to an ordinary pretreatment such as degreasing or the like is subjected to a cathode reduction treatment in a soln. contg. >=50g/l free hydrochloric acid at >=0.5A/dm<2> cathode current density with said stainless steel as a cathode and Ni (alloy) as an anode. The use of an Ni-Fe alloy, etc. which are more inexpensive than costly Ni as the anode is practical. The stainless steel is rinsed in succession to the above- mentioned cathode reduction treatment to deposit Ni and is then subjected to desired plating by which the intended plated stainless steel is obtd. The metal plating is accomplished by Ag plating using a cyanide bath, Cu plating using a cyanide bath or sulfuric acid bath, Pd plating using an amine complex bath, etc. Such plated stainless steel has extremely smaller contact resistance than the conventional product even after humidification and heating and maintains an excellent electrical contact characteristic in a severe environment for a long period of time.
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