| 摘要 |
PURPOSE:The titled resin composition which is soluble in an inexpensive phenolic solvent and can form an electrical-insulating, baked coating film having excellent adhesion, flexibility, and stability, made by compounding a polyester-imide resin and a specified polyamide-imide resin. CONSTITUTION:A polyamide-imide resin made by reacting a tricarboxylic acid (derivative) (a) (e.g. trimellitic anhydride) containing citric acid (preferably citric anhydride) with a diisocyanate (e.g. 4,4'-diphenylmethane diisocyanate) and/or a diamine (e.g. 4,4'-diaminodiphenylmethane) (b) is used. Into the polyamide-imide resin (A) is incorporated about 20-50wt% (on a solid basis) polyester-imide resin (B), preferably followed by heating thereof at about 100-200 deg.C for several hours to obtain the heat-resistant resin composition.
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