| 摘要 |
<p>A process for bonding surfaces together comprises (i) exposing to actinic radiation a layer of a liquid composition containing an epoxide resin, photopolymerizable compound, and a heat-activated curing agent for epoxide resins until the composition solidifies to form a film adhesive while the epoxide resin remains substantially heat-curable, (ii) sandwiching the film adhesive between the surfaces to be bonded, and (iii) then heating the assembly so that the epoxide resin component of the film adhesive is cured. Surfaces which may be so bonded may be metal, glass, ceramic, or wood.</p> |
