| 摘要 |
PURPOSE:To process a lead efficiently with high accuracy, and to improve safety and workability by carrying a lead frame to a tray slidably mounted to a guide plate fitted on the bottom force side and regulating the position of the tray by a center pin and a pilot pin. CONSTITUTION:A lead frame 17 to which a plurality of IC chips 15 are disposed at regular intervals is received in a recessed section 13a in a tray 13, and positioning pins 21 fitted to the base of the recessed section in the tray 13 are fitted into positioning holes 18 formed to the lead frame 17. Consequently, the lead frame 17 is carried in the recessed section 13a in the tray 13 without positional displacement. The tray 13 is inserted into a recessed section 14a in a guide plate 14 mounted to the bottom force side, and the tips of center pins 22 are brought into contact with V grooves 13b formed to the side surface of the tray 13. The tray 13 is transferred at every one pitch by pushing the tray in the direction of the arrow A as shown in the figure, and each lead 16 for the IC chips 15 is processed simultaneously at a time. |
