| 摘要 |
PURPOSE:To obtain an apparatus for bonding an IC element to a lead which generates no vibrations or the like, by providing a theta table reciprocally rotating around the Z axis vertical to the surface of the element, and X and Y tables movable in the X and Y directions which are rectangular to each other as well as to the Z direction, such that one end of the Z direction of this XYtheta moving mechanism is fixed while the other end is provided with a bonding tool reciprocally movable in the Z direction. CONSTITUTION:A base frame 1 is provided thereon with a holding mechanism 4, on which a lead frame 3 supporting securely an IC element 2 to be bonded is placed. An L-shaped support post 5 is mounted in parallel to the vertical axis 6 of the frame 1. Then, an X table 7, a Y table 8 and a theta table 9 are interposed and attached to the lower face of the horizontal part of the post 5. On the lower face of the table 9, attached is a bonding head 10 provided with a bonding tool 12 movable vertically through an arm 11. A camera 13, positioned on the vertical axis of the tool 12, is provided on the lower face of the head 10 so as to improve the reliability of the bonding work. |
