| 摘要 |
PURPOSE:To inhibit the change in characteristic due to the stress affected by a lead frame by a method wherein the same material as a resin material coating the surface of an element is used as the adhesive, in adhering on the lead frame a magnetoelectric conversion element using a piezoelectric substance such as Si sensitive to pressure. CONSTITUTION:A semiconductor substrate 21 with the magnetoelectric conversion element is fixed to the element-fixing part of the lead frame 22 by using the adhesive 23, and the wiring electrodes provided thereon are connected to leads constituting the frame with bonding wires 24. Thereafter, the substrate 21 is enveloped with a surface coating material 26, and an IC thus made is sealed with a molding material 25 made of epoxy resin or the like into the titled package. In this construction, when the coating material 26 enveloping the substrate 21 is silicone resin, the same resin is also used for the adhesive 23. In any case, the same material is used for these, thus making the package free of element strain due to the change in temperature. |
