Ultra-high speed semiconductor integrated circuit device having a multi-layered wiring board.

摘要

@ This invention relates to an ultra-high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals (24) of a package (21) and signal pads (25) on a chip (22). The device includes a wiring board (26), positioned above the chip, which comprises a transmission line having a predetermined characteristic on an insulating plate. The transmission line is in the form of a strip line or a coplanar transmission line including a signal line (20a,...) and a grounded conductor film (21 a). The wire board is positioned over the chip to connect the bonding pads on the chip to respective other leads (23) through the inner lead terminals (24). The wirings between the transmission lines may cross each other by using a multi-layered structure. As a result, the transmission loss is reduced, and it is possible to design a wiring board having an optimum performance for ultra-high speed operation of a high density integrated circuit device.