| 摘要 |
PURPOSE:To obtain the titled Cu alloy exceeding considerably a conventional Cu alloy in strength and heat resistance and having satisfactory adhesive strength to plating and solderability by adding prescribed amounts of Ni, Al, Si and Sn to Cu. CONSTITUTION:This Cu alloy for a lead frame consists of, by weight, 0.5-5.0% Ni, 0.5-5.0% Al, 0.05-2% Si, <=4% Sn and the balance Cu. Intermetallic compounds such as NixAly, NixSiy and NixSny are finely precipitated in Cu as the base of the Cu alloy, and Ni, Al, Si and Sn are solubilized in the base, so the Cu base is strengthened.
|
