发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the productivity making single time alignment of connecting sheet feasible by a method wherein slits to separate corresponding to each terminal of electrode bumps are formed in the central part of a separating sheet which is aligned with each electroce bump to be thermally fixed by pressure cutting off the both edges opposing to the slits. CONSTITUTION:Slits 11a to separate corresponding to each terminal align a connecting sheet 11 formed by stamping process etc. in the central part with electrode bumps 2, 3, 4 to be thermally fixed by pressure. Successively along the cut off lines A represented by the chain lines by means of a press machine etc. Thus the connecting sheet is separated into each connecting pieces respectively adhered to each terminal. Through these procedures, each connecting piece may be formed with precious gaps by means of thermal pressure fixing one connecting sheet on the electrode bumps 2, 3, 4 of each terminal and then separating into each connecting piece.
申请公布号 JPS60128648(A) 申请公布日期 1985.07.09
申请号 JP19830238614 申请日期 1983.12.15
申请人 MITSUBISHI DENKI KK 发明人 KOJIMA TAKAHIDE;IKI SHIGEO;SAKAYORI TAKAO
分类号 H01L21/60;H01L21/603;H01L23/495 主分类号 H01L21/60
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