发明名称 |
Leadless chip placement machine for printed circuit boards |
摘要 |
Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placement of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90 DEG apart about the central axis of the head. As the turret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, a centering and orienting station, and a placement station. Located between the testing and orienting stations is a chip removal station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect defective P.C. boards so that they may be bypassed. A controller, such as a digital computer, provides additional monitoring and controls the operation of the machine.
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申请公布号 |
US4527324(A) |
申请公布日期 |
1985.07.09 |
申请号 |
US19840603905 |
申请日期 |
1984.04.25 |
申请人 |
UNIVERSAL INSTRUMENTS CORPORATION |
发明人 |
DEAN, WEIBLEY J.;JOHNSON, CHARLES E.;RAGARD, PHILLIP A. |
分类号 |
H05K13/04;H05K13/08;(IPC1-7):H05K3/30 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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