| 摘要 |
A zero insertion force connector is provided for a dual-in-line integrated circuit package. The connector includes a base, a plurality of spring loaded contacts mounted in recesses extending along opposed sides of the base, and a frame which surrounds and is slidably mounted on the base. The recesses in which the contacts are mounted correspond in number and spacing to the leads on the integrated circuit package. The frame is slidably movable between extreme raised and lowered positions, and includes cam fingers aligned with the respective contacts. The frame is constructed such that in its lower position the cam fingers thereof urge the leads of the integrated circuit package against the contacts mounted in the base.
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