Polyamide resin composition

摘要

A polyamide resin composition which comprises 20 to 80 wt % of polyamide resin and 80 to 20 wt % of inorganic fibers, 85 to 15 wt % of said inorganic fiber being glass fiber and remaining 15 to 85 wt % being ground mineral fiber having an aspect ratio of 5 to 100. The composition has high strength and high modulus of elasticity and is suitable for molding. The composition provides moldings having good surfaces.