| 摘要 |
<p>PURPOSE:To facilitate a breaking by emitting a laser beam to the surface of a wafer, simultaneously emitting it to the back surface and scribing the wafer from both side surfaces. CONSTITUTION:A wafer 2 is set onto a transparent holding plate 12, and secured by holding pieces 14a-14c. A laser beam is emitted to both the front and back surfaces while moving a holding base 11 in a horizontal direction, and a groove is formed on a scribing line. N2 gas is blown to an air gap between the wafer 2 and a transparent holding plate 12 during the emission of the beam, and the generated SiO2 is exhausted. Thus, the breaking of the wafer is facilitated to eliminate thermal and mechanical damages to the integrated circuit portion.</p> |
