发明名称 FLUX FOR JOINING MICROELECTRONIC PARTS
摘要 PURPOSE:To decrease corrosiveness to base metals, etc. and to improve a joining effect by incorporating a chelate agent which forms a chelate compd. with the essential components of solder and contg. a specific weight % of 5-sulfosalicylic acid, etc. as an activating agent into a flux. CONSTITUTION:A chelate agent which dissolves in an org. solvent suchas alcohol or the like and forms selectively a ochelate compd. with the essential components of solder is incorporated as an activating agent into a flux. One kind of any among 0.2-20% 5-sulfosalicylic acid, 0.5-10% morin, 1-10% sodium diethyldithiocarbamic acid and 2-10% thiourea is incorporated as an activating agent into the chelate agent. The corrosiveness to the base metals to be joined is thereby considerably suppressed and the excellent flux effect is obtd. even at a low temp. the effect of joining is thus improved even in joining at a low heat resistant temp.
申请公布号 JPS60127096(A) 申请公布日期 1985.07.06
申请号 JP19830232856 申请日期 1983.12.12
申请人 NIPPON DENSHIN DENWA KOSHA 发明人 FUJIWARA KOUICHI;ASAHI MASAYOSHI
分类号 B23K35/363;B23K35/36 主分类号 B23K35/363
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