| 摘要 |
<p>PURPOSE:To remove heat effectively from a semiconductor element by flowing a cooling fluid through a flow path for a cooling device formed in laminated structure of a large number of plates and cooling the cooling device by the collision and ejection of the fluid. CONSTITUTION:A semiconductor element 3 is connected electrically to a wiring substrate 1 by soldering terminals 2, and a cooling device 4 is bonded with the back of the element 3. The cooling device 4 is constituted by sticking plates 10-16 with slits and holes together in a laminating manner. A large number of nozzles 5 directed in the back direction of the element 3 and cooling-fluid flow paths 6 are formed in the cooling device 4, and each cooling device 4 is connected by pipes 7. When flowing a cooling fluid, the fluid enters an inflow section 8 from the pipe 7, and is ejected from the nozzles 5 and collides with the plate 10 bonded with the element 3, thus cooling element 3. Accordingly, the semiconductor element 3 can be cooled effectively.</p> |
