| 摘要 |
PURPOSE:To prevent the attachment of a resist liquid to the back side of a semiconductor wafer by a method wherein, in coating the front of the wafer with the resist liquid by the spinner method, a parallel groove is provided in proximity to an orientation flat line provided in the wafer. CONSTITUTION:When the front of the semiconductor wafer 1 provided with the orientation flat line 2 at the peripheral edge is coated with the resist, the shallow stopping groove 4 slightly longer than the line 2 and parallel therewith is kept bored in proximity to the inside of the line 2. In such a manner, at the time of spin coating of the resist while the wafer 1 is rotated, the resist does not diffuse to the end, and the resist 3 does not attach to the back on the line 2 side. Besides, the resist 3 may flow to the peripheral edge without the line 2, but it is no problem to the efficiency of wafer use because this place is the region not used. |
