| 摘要 |
PURPOSE:To form an orifice with high accuracy by a method in which a corrosion-resistance auxiliary metal layer is provided on the surface of a base plate made of an ink corrosion-resistant conductive material and a non-conductive pattern for orifice is formed on the auxiliary metal layer. CONSTITUTION:An auxiliary metal layer 11 is formed on the surface of a base plate 10 made of a conductive material resistant to corrosion by ink liquid (e.g., Ni, SUS304 steel, etc.). The auxiliary metal layer made of Au, Pt, etc., is formed on the base plate 10 by vapor deposition by a PVP method. A photo-resist 12 is uniformly coated on the layer 11 and hardened by closely contacting a photo mask with the resist 12 by exposure to light, followed by developing treatment and cleaning treatment, to form a non-conductive pattern 12A. The base plate 10 is dipped in a Ni electrodeposition liquid to crystallize an Ni thin film 13, and etching is applied to the back side of the plate 10. |
