| 摘要 |
PURPOSE:To prevent the decrease in throughput due to batch processing by a method wherein recognition codes are stamped on a lead frame or a package surface by laser processing, and the manufacturing process is concentratedly managed by recognizing these codes. CONSTITUTION:When a desired chip and a lead frame are supplied to a chip bonding machine 3, desired bar codes are stamped on the lead frame surface by means of a laser beam led out through an optical fiber from a laser stamping machine 6, resulting in bonding. Next, when the lead frame with chips is supplied to a wire bonding machine 4, the bar codes are read out by means of a bar code reader 7 through an optical fiber, and this information is fed to a concentration controller 5. Then, a wire-wiring method based on the information is instructed to the machine 4, and bonding is performed. In such a manner, even when products different in type, model, and lot number are mixed with each other and fed in each process, they are delivered by working without errors. |
