发明名称
摘要 PURPOSE:To prepare a polyamide resin having improved moldability, capable of molding articles with excellent impact rsistance on moisture absorption, and surface properties, comprising a specific modified silicone oil. CONSTITUTION:A polyamide, e.g. polycaprolactam or polyhexamethylene sebacamide, is incorporated with about 0.5-25 wt.%, preferably 1-15 wt.%, of a modified silicone oil having an epoxy or hydroxyl group equivalent of about 500- 4,000 and a viscosity at 25 deg.C >= 1,000 CSt. Preferably, the silicone oil is melt kneaded with a molten polyamide at the last stage or completion of the polymerization, or with molten polyamide chips.
申请公布号 JPS6028317(B2) 申请公布日期 1985.07.04
申请号 JP19780066409 申请日期 1978.06.02
申请人 MITSUBISHI CHEM IND 发明人 HAYASHI MASAHIRO;YOSHIMURA KAN;OIKAWA TAKASHI;YOSHII TOORU
分类号 C08L77/00;C08L83/00;C08L83/04 主分类号 C08L77/00
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