发明名称 |
Process for soldering semiconductor components |
摘要 |
<p>A novel process for soldering semiconductor components is proposed. A semiconductor component with an aluminium layer is subjected to a fluorine-containing plasma for at least one hour. The aluminium layers treated in this way can then be wetted exceptionally well with conventional solders.</p> |
申请公布号 |
DE3442538(A1) |
申请公布日期 |
1985.07.04 |
申请号 |
DE19843442538 |
申请日期 |
1984.11.22 |
申请人 |
BBC AKTIENGESELLSCHAFT BROWN,BOVERI & CIE. |
发明人 |
GOBRECHT,JENS,DR. |
分类号 |
B23K1/20;B23K35/38;H01L21/60;(IPC1-7):B23K1/02;B23K31/02 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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