发明名称 Process for soldering semiconductor components
摘要 <p>A novel process for soldering semiconductor components is proposed. A semiconductor component with an aluminium layer is subjected to a fluorine-containing plasma for at least one hour. The aluminium layers treated in this way can then be wetted exceptionally well with conventional solders.</p>
申请公布号 DE3442538(A1) 申请公布日期 1985.07.04
申请号 DE19843442538 申请日期 1984.11.22
申请人 BBC AKTIENGESELLSCHAFT BROWN,BOVERI & CIE. 发明人 GOBRECHT,JENS,DR.
分类号 B23K1/20;B23K35/38;H01L21/60;(IPC1-7):B23K1/02;B23K31/02 主分类号 B23K1/20
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