ELECTRONIC CIRCUIT PACKAGE LOCAL HEAT SINK SYSTEM,申请号JP19830232083-传众专利搜索

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发明名称	ELECTRONIC CIRCUIT PACKAGE LOCAL HEAT SINK SYSTEM
摘要
申请公布号	JPS60124900(A)	申请公布日期	1985.07.03
申请号	JP19830232083	申请日期	1983.12.08
申请人	NIPPON DENKI KK	发明人	WATANABE HISAO
分类号	H05K7/20	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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