| 摘要 |
PURPOSE:To improve heat dissipation characteristics by coating the surface of a sealing resin with a metal and directly coupling the sealing resin with a radiator plate on the outside. CONSTITUTION:A metallic plate 12 on which a semiconductor chip 11 is placed is coated completely with a resin 13. A metal 15 is formed on the surface of the resin 13, and bonded with an external radiator plate 14. Heat reaching to the surface of the resin 13 is transmitted over the radiator plate 14 through the metal 15, and heat dissipation characteristics are improved largely. Two of a lead frame containing the metallic plate 12 for dissipating heat and the metallic plate 15 are used, molded integrally with the resin, and cut, thus manufacturing the titled package at low cost. |
