| 摘要 |
PURPOSE:To prevent a spring tape from coming in contact with a semiconductor body by a method wherein a ring-shaped Ag bump is provided on a ring-shaped metal layer covering a ring-shaped opening provided in an insulating film on a semiconductor body. CONSTITUTION:With the intermediary of a ring-shaped opening provided in an insulating film 13 covering an epitaxial layer 12 on a semiconductor substrate 11, a diffused layer 14 is formed in a ring shape. A Ti-Pt ground metal coating is provided, to be formed into a ground metal layer 15 by selective etching with help of the photoresist (PR) method. A ring-shaped pattern is formed by the PR method and then an Au-plated layer 7, Ag bump 18 are formed. With the Ag bump 18 built at a location nearest to the outermost circumference of the semiconductor body, a spring tape 9 does not contact any part of the semiconductor body, and this eliminates a process of mesa-etching. |
