| 发明名称 |
Antistatic packaging material and steel substrates packaged therewith |
| 摘要 |
A novel antistatic packaging material and method employing a F+-implanted electractive polymer are described. The implanted polymer contacts the surface of the substrate and conducts away any static charge that may exist upon the substrate.
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| 申请公布号 |
US4526832(A) |
申请公布日期 |
1985.07.02 |
| 申请号 |
US19830534477 |
申请日期 |
1983.09.21 |
| 申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY |
发明人 |
BERNETT, MARIANNE K.;WEBER, DAVID C.;RAVNER, HAROLD |
| 分类号 |
B32B7/02;H01B1/12;(IPC1-7):B32B27/08;B05D3/06;B21D53/10;H01B1/02 |
主分类号 |
B32B7/02 |
| 代理机构 |
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