| 摘要 |
A holding apparatus for holding dual pin type electronic parts such as DIP type IC etc. when the electronic parts are cleaned or dried. The holding apparatus is used, for example, for cleaning or drying the dual pin type electronic parts automatically in line after the lead pins of the electronic parts are dipped by solder. The holding apparatus has at least one holding rod which holds the electronic parts on a mounting table in order to prevent the electronic parts from dropping off while the mounting table is rotated around a shaft, and the holding rod releases the electronic parts after the cleaning or drying thereof are completed.
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