CASE FOR SEMICONDUCTOR DEVICE WITH SINGLE-SIDE COOLING

摘要

The invention relates to a package for a semiconductor component which is cooled on one side. It has an improved bonding of the semiconductor component to the base due to resistance welding, without a soldered-on welding projection. The cited object is achieved by bending and processing the edge of the flange of the pressed structure which forms the welding projection. The pressed structure is soldered onto the base.