发明名称 RESIN-SEALING METAL MOLD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the pull-up of resin in pulling up a plunger pressing a resin reservoir together with the both by a method wherein the bottom of the resin reservoir is kept provided with a projection facing upward when a center block having a resin reservoir at the center is sandwiched by cavity blocks with gates, runners, and cavities into the titled mold. CONSTITUTION:The resin reservoir provided in the surface of the center block 10 is filled with a sealing resin 32 such as epoxy, and required resin sealing is carried out by pressing the plunger 31 on an aperture bored in the upper mold 30, and then by carrying the resin into the cavity blocks connected to the block. In this construction, as shown in a separate drawing, the center block 10 is sandwiched by the cavity blocks 20 and 20' having the cavities 21 and 21', runners 22 and 22', and gates 23 and 23'. At this time, the bottom of the resin reservoir 11 is provided with the projection 12 tapered upward, and thus the simultaneous pull-up of the resin at the time of pulling the plunger 31 is interrupted.
申请公布号 JPS60121728(A) 申请公布日期 1985.06.29
申请号 JP19830229701 申请日期 1983.12.05
申请人 TOSHIBA KK 发明人 MORI HIDEMI
分类号 H01L21/56;B29C33/00;B29C45/02;B29C45/14;B29C45/26;B29C45/27 主分类号 H01L21/56
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