发明名称 COMPOUND MOLDED BODY FOR GAS SEPARATION
摘要 PURPOSE:To obtain a compound molded body for gas separation having high permeability of oxygen and large separation factor for nitrogen from oxygen by forming a polymerized film of a gaseous org. compd. using low temp. plasma on the surface of a molded product of polymer of an org. unsatd. compd. contg. Si. CONSTITUTION:An org. unsatd. compd. as expressed by the formula is polymerized by an appropriate method. (In the formula, R<1> is 1-8C univalent hydrocarbon group; R<2> and R<3> are same or different groups selected from 1-8C univalent hydrocarbon group and 1-8C univalent hydrocarbon group and 1-8C alkoxy group; R<4> is a group selected from 1-8C univalent hydrocarbon group, 1-8C alkoxy group, and triorganosilyl alkylene group). Preferred degree of polymn. is >=1,000. The polymer can be formed to a film, but an appropriate support may be used also. A low-temp. plasma polymerized film is formed on said molded polymer body. For this stage, a gaseous org. compd. such as organosilicon compd., organofluorine compd. etc. is introduced into a low temp. plasma generator; coexistence of inert gas such as N2, O2, etc. may be permitted. Suitable film thickness is 0.005-1mu.
申请公布号 JPS60122026(A) 申请公布日期 1985.06.29
申请号 JP19830227996 申请日期 1983.12.02
申请人 SHINETSU KAGAKU KOGYO KK 发明人 UENO SUSUMU;NOMURA HIROKAZU;KITAMURA HAJIME
分类号 B01D53/22;B01D67/00;B01D71/44;B01D71/70 主分类号 B01D53/22
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