| 摘要 |
PURPOSE:To prevent the deformation of an inner lead and a tab and the deterioration of the flatness of the inner lead by fixing the inner lead and the tab by a fixing material and surface-treating them. CONSTITUTION:A lead frame is held between jigs 7, and regions, which need not be surface-treated, in inner leads 1 and a tab 2 are filled with a fixing material 6. Sections where the surfaces of the leads 1 and the tab 2 are exposed are plated by using a jig 7 as it is or using a jig of another shape. The leads 1 and the tab 2 weak to external force are unified by the fixing material 6 and surface-treated by the semiconductor device and manufacture for said device, and the lead frame, the positional displacement, stagger and bending of the leads 1 and the tab 2 thereof are prevented and which has excellent flatness, is obtained. |
