发明名称 MOLDING METHOD FOR RESIN-SEALED ELECTRONIC COMPONENT
摘要 PURPOSE:To facilitate the directional discrimination of components by eliminating burrs generating in an index part made up of a projection by a method wherein, in molding of an electronic component with resin, one end of a lead frame sandwiched by the upper and lower metal molds is provided with the inward projection, and the resin outflow from a cavity is blocked at the time of resin molding. CONSTITUTION:The electronic component is fixed on the lead frame 10 consisting of outer leads 10a, dams 10b, and inner leads 10c, and, in covering the upper and lower surfaces of the frame 10 with a resin molded layer 14 while the outer leads 10a are projected outward, the following process is taken: one end of the component-mounting part is provided with the inward recess 10d for index formation, and the upper and lower metal molds for molding are provided with recesses covering them so as to prevent the invasion of resin to the recess 10d. This manner allows the generation of no burrs at the index recess 10d for discriminating the direction of components, and accordingly the discrimination is facilitated that much.
申请公布号 JPS60121727(A) 申请公布日期 1985.06.29
申请号 JP19840140524 申请日期 1984.07.09
申请人 HITACHI SEISAKUSHO KK 发明人 YAMADA TOMIO
分类号 H01L23/50;H01L21/56 主分类号 H01L23/50
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